By Suryadevara Babu
Advances in Chemical Mechanical Planarization (CMP) provides the most recent info on a mainstream technique that's serious for high-volume, high-yield semiconductor production, or even extra in order machine dimensions proceed to scale back. The know-how has grown to surround the removing and planarization of a number of steel and dielectric fabrics and layers either on the gadget and the metallization degrees, utilizing diverse instruments and parameters, requiring advancements within the regulate of topography and defects.
This very important booklet deals a scientific overview of basics and advances within the zone. half One covers CMP of dielectric and steel movies, with chapters concentrating on using specific strategies and procedures, and on CMP of specific quite a few fabrics, together with extremely low-k fabrics and high-mobility channel fabrics, and finishing with a bankruptcy reviewing the environmental affects of CMP approaches.
Part addresses consumables and strategy keep watch over for superior CMP, and contains chapters at the education and characterization of slurry, diamond disc pad conditioning, using FTIR spectroscopy for characterization of floor approaches, and methods for defection characterization, mitigation, and reduction.
- Considers innovations and methods for CMP of dielectric and steel films
- Includes chapters dedicated to CMP for specific materials
- Addresses consumables and technique keep an eye on for greater CMP
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Advances in Chemical Mechanical Planarization (CMP) (Woodhead Publishing Series in Electronic and Optical Materials) by Suryadevara Babu